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COM-Express Type 6『PCOM-B657VGL』

Some industrial processors are guaranteed to operate at temperatures ranging from -40 to 85°C!

The "PCOM-B657VGL" is a COM-Express Type 6 module compatible with the 11th generation mobile Intel Core processors. It can be equipped with processors for embedded and industrial use, with the latter having a wide operating temperature range of -40 to 85°C, making it suitable for outdoor and freezing environments. It also supports ECC, allowing for safe use in mission-critical applications such as financial machines. PCI Express supports the latest Gen4, making it compatible with cutting-edge graphics cards and NVMe. 【Features】 ■ Equipped with Intel 11th generation mobile Core, Celeron, and Xeon W-1100E series processors using a 10nm process ■ Supports processors with up to 8 cores/16 threads and power consumption ranging from 25W to 45W ■ Capable of supporting large capacity memory of up to 64GB (DDR4 3200MT/s) ■ Equipped with PCI Express 4.0 x 16 lanes and PCI Express 3.0 x 8 lanes *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Using embedded computer modules

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AIB-MO22/32 | AIB-MN32/42

DeviceEdge Jetson Series

● The NVIDIA Jetson Orin NX module delivers up to 100 TOPS, which is more than three times that of the NVIDIA Jetson AGX Xavier module and about five times that of the NVIDIA Jetson Xavier NX module. The NVIDIA Jetson Orin Nano achieves a maximum of 40 TOPS, which is 80 times that of the NVIDIA Jetson NanoTM module. ● It is equipped with 1 x M.2 E-Key for Wi-Fi/BT and 1 x M.2 M-Key for storage. To ensure sufficient data storage for edge computing, it supports external M.2 2242 NVMe with high-speed data transmission capabilities. ● It is adapted to operate in challenging environments for various embedded applications, particularly in smart factories, smart cities, and smart transportation, with an operating temperature range from -25°C to 80°C and a wide input power range from 12 to 24 VDC.

  • Industrial PCs
  • Using embedded computer modules

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